(footprint "OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm"
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	(layer "F.Cu")
	(descr "OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, generated with kicad-footprint-generator ipc_bga_generator.py, https://www.onsemi.com/pub/Collateral/570CP.PDF")
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	(embedded_fonts no)
	(model "${KICAD9_3DMODEL_DIR}/Package_CSP.3dshapes/OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm.step"
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)
