(footprint "ST_WLCSP-36_2.652x2.592mm_Layout7x12_P0.4mm_Stagger_Offcenter"
	(version 20241229)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "ST WLCSP-36, ST Die ID 028, 2.652x2.592mm, 36 Ball, Y-staggered 7x12 Layout, 0.4mm Pitch, generated with kicad-footprint-generator ipc_bga_generator.py, https://www.st.com/resource/en/datasheet/stm32wb05tz.pdf#page=55")
	(tags "CSP 36 0.4 ST-Die-028 ST-Package-01C1")
	(solder_mask_margin 0.0325)
	(solder_paste_margin 0.0125)
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	(pad "A2" smd circle
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	(pad "E2" smd circle
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	(pad "F3" smd circle
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	(pad "G4" smd circle
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		(property pad_prop_bga)
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	(pad "M5" smd circle
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		(size 0.225 0.225)
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	(pad "M7" smd circle
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	(embedded_fonts no)
	(model "${KICAD9_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-36_2.652x2.592mm_Layout7x12_P0.4mm_Stagger_Offcenter.step"
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			(xyz 0 0 0)
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		(scale
			(xyz 1 1 1)
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		(rotate
			(xyz 0 0 0)
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	)
)
