(footprint "ST_WLCSP-39_2.76x2.78mm_Layout11x7_P0.4mm_Stagger"
	(version 20241229)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "ST WLCSP-39, ST Die ID 478, 2.76x2.78mm, 39 Ball, X-staggered 11x7 Layout, 0.4mm Pitch, generated with kicad-footprint-generator ipc_bga_generator.py, https://www.st.com/resource/en/datasheet/stm32h523he.pdf#page=197")
	(tags "CSP 39 0.4 ST-Package-B0MM")
	(solder_mask_margin 0.0375)
	(solder_paste_margin 0.0375)
	(property "Reference" "REF**"
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		(fill yes)
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		(stroke
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		(fill no)
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	(pad "C5" smd circle
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	(pad "C7" smd circle
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	(pad "C9" smd circle
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	(pad "C11" smd circle
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	(pad "D2" smd circle
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	(pad "D4" smd circle
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	(pad "G1" smd circle
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		(size 0.25 0.25)
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	(pad "G3" smd circle
		(at -0.6 1.03923)
		(size 0.25 0.25)
		(property pad_prop_bga)
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	)
	(pad "G5" smd circle
		(at -0.2 1.03923)
		(size 0.25 0.25)
		(property pad_prop_bga)
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	)
	(pad "G7" smd circle
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		(size 0.25 0.25)
		(property pad_prop_bga)
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	)
	(pad "G9" smd circle
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		(size 0.25 0.25)
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	(pad "G11" smd circle
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		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
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	(embedded_fonts no)
	(model "${KICAD9_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-39_2.76x2.78mm_Layout11x7_P0.4mm_Stagger.step"
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			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
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	)
)
